Casela Technologies (Casela), a leading innovator in high-power semiconductor laser solutions, today announced the launch of ELSA-16, a next-generation, pluggable 16-channel External Laser Source (ELS) platform designed to unlock new levels of performance, flexibility, and scalability in Co-Packaged Optics (CPO) and silicon photonics-based systems powering AI workloads.

Engineered for the rapidly evolving demands of AI infrastructure, the ELSA-16 integrates 16 high-power Distributed Feedback (DFB) lasers with advanced control electronics in a compact, thermally optimized form factor. With optional TEC (Thermoelectric Cooler) integration for enhanced wavelength stability, the platform is fully customizable to target specific power, wavelength, and efficiency requirements. ELSA-16 modules utilize polarization-maintaining (PM) fiber outputs and an OSFP electrical interface with CMIS-based firmware for seamless integration.

“The ELSA-16 represents a quantum leap in flexible and scalable external laser sources,” said Milind Gokhale, Co-Founder and CTO of Casela. “From powering high-bandwidth chiplet I/O to enabling dense wavelength division multiplexing, ELSA-16 is the ideal solution for next-generation optical networks.”

Key features of the ELSA-16 platform include:

1. Customizable Power Profiles: Supports Casela’s 200–300 mW class lasers with fiber-coupled output powers ranging from 150–200 mW per channel.
2. Broad Wavelength Support: Available in 1310nm and CWDM-4 options for DR/FR links, and CW-WDM/DWDM variants for ring-based silicon modulators.
3. Comb Source Capability: Enables up to 128 optical channels via 16 x 8-comb source configurations, with >12mW per wavelength per fiber on a 200 GHz grid.
4. DWDM Scalability: Future-ready for tighter wavelength spacing and dynamic control to support evolving CPO architectures.

At OFC 2025, Casela will showcase a 16-wavelength version of ELSA-16, each powering dense comb sources to demonstrate the platform’s potential to support 128+ channels in a compact, pluggable form—redefining the limits of scalability in AI and HPC systems. Visit the company in meeting room 6549 to preview Casela’s entire ELSA-16 product family.

On Sunday, March 30, Casela’s CTO Milind Gokhale joined a panel of industry leaders during the “High Power and Multi-Wavelength Laser Light Sources” workshop at OFC 2025. In a forward-looking discussion, the group explored how innovation in laser architecture, integration and performance will drive the next generation of optical interconnects for AI/ML. Topics included multi-wavelength roadmaps, serial and parallel interface demands, high-efficiency packaging and the scalability required for future systems.

As AI and high-performance computing continue to demand ultra-efficient and high-bandwidth I/O, Casela’s ELSA-16 platform delivers industry-leading wall plug efficiency, precise wavelength control, and unparalleled scalability. With support for high-density, parallel optical links, ELSA-16 offers a clear path toward more compact, power-efficient, and cost-effective optical interconnects at the silicon level.

About Casela Technologies: Casela is a pioneer in high-power semiconductor laser design, delivering cutting-edge laser solutions for data center, AI, and telecom applications. With deep expertise in silicon photonics and optical integration, Casela’s mission is to accelerate the future of optical interconnects through innovation, performance, and scalability. For more information, www.caselatech.com

Wilkinson + Associates

Leah Wilkinson

+1 703-907-0010

leah@wilkinson.associates

https://www.caselatech.com/

View source version on newsdirect.com: https://newsdirect.com/news/introducing-elsa-16-casela-technologies-powers-the-future-of-ai-i-o-with-breakthrough-16-channel-external-laser-source-platform-architectures-883362093

This press release is distributed by News Direct. Blockchain Registration, Verification & Enhancement provided by NewsRamp™. The source URL for this press release is Introducing ELSA-16: Casela Technologies Powers the Future of AI I/O with Breakthrough 16 Channel External Laser Source Platform Architectures.