Curated News
By: NewsRamp Editorial Staff
October 01, 2026
SUSS MicroTec Launches GreenTec Solutions, Enters Wafer Cleaning Market
TLDR
- SUSS enters the EUR 5.4 billion wafer-cleaning market with GT200, leveraging proven technologies to gain an edge in advanced packaging.
- The GT200 combines TurbulenStrip and CrustBuster technologies into a hybrid platform that removes photoresist and residues without hazardous chemicals.
- GreenTec Solutions reduces chemical consumption and eliminates hazardous acids, making semiconductor manufacturing safer and more sustainable for the planet.
- SUSS's GT200 cleans wafers using UV light and batch soaking, cutting chemical use and tool complexity for 200mm fabs.
Impact - Why it Matters
This news matters because it signals a significant shift toward more sustainable and efficient semiconductor manufacturing. As the industry grapples with environmental regulations and the need for cost reduction, SUSS's GreenTec Solutions offer a way to reduce chemical consumption and eliminate hazardous substances without compromising performance. The entry into the wafer-cleaning market, valued at EUR 5.4 billion, positions SUSS to capitalize on the growing demand for advanced packaging and heterogeneous integration driven by AI and high-performance computing. For chipmakers, the GT200 provides a scalable path from R&D to high-volume manufacturing, potentially lowering overall cost-of-ownership and supporting ESG goals. Ultimately, this innovation could lead to more environmentally friendly and economically viable production of the microchips that power everything from smartphones to data centers.
Summary
SUSS MicroTec SE, a leading supplier of semiconductor equipment based in Garching, Germany, has announced its strategic entry into the wafer-level cleaning market with the launch of the GreenTec Solutions product line and its first system, the GT200. The move expands the company's portfolio into a market valued at approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and growing demand from AI and high-performance computing applications. "GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy," said CEO Burkhardt Frick. The new line leverages proven technologies from SUSS's Photomask Solutions segment, including TurbulenStrip and CrustBuster, to deliver a hybrid cleaning approach that reduces chemical consumption and eliminates hazardous acids and organic solvents.
The GT200 is designed for 200 mm wafer processing in R&D, qualification, and production for MEMS, RF, power device, and CMOS applications. It combines photoresist removal, surface activation, and final cleaning in one configurable platform, helping fabs reduce tool fragmentation and simplify process flows. SUSS supports customers with joint evaluation programs, process co-development, and recipe optimization to accelerate adoption and de-risk technology transfers. The company plans to launch a 300 mm high-volume manufacturing platform in 2027, followed by a 200 mm HVM platform in 2028, providing a clear migration path from evaluation to full-scale production. "The GreenTec Solutions product line represents our vision for the next generation of semiconductor manufacturing - where sustainability and process excellence go hand in hand," said Yuta Nagai, Senior Vice President Photomask Solutions at SUSS. The GT200 will be showcased at SEMICON West, with registration available here.
Source Statement
This curated news summary relied on content distributed by NewMediaWire. Read the original source here, SUSS MicroTec Launches GreenTec Solutions, Enters Wafer Cleaning Market
