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AI Packaging Race Heats Up as Nightfood Forms TechForce Subsidiary

Nightfood forms TechForce Advanced Manufacturing to produce wafer sorters and AOI systems for 8-inch and 12-inch wafers, targeting Q4 2026 revenue amid AI packaging demand.

The AI industry’s next big challenge is packaging, not just chip design. As NVIDIA’s Jensen Huang calls for faster CoWoS-L output, the entire supply chain—from materials to automation—must scale. Nightfood’s new TechForce subsidiary aims to supply critical wafer sorting and inspection tools, potentially easing bottlenecks that delay AI data center buildouts. If successful, this could accelerate AI deployment and create new competition for established equipment makers like Applied Materials, KLA, and Lam Research. For investors, it highlights a growing niche within the AI infrastructure boom, but also the long lead times and technical hurdles facing newcomers.