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AI Packaging Bottleneck Spurs Nightfood's TechForce Robotics Push

Nightfood's TechForce Robotics forms advanced manufacturing unit for wafer sorters and AOI systems, targeting Q4 2026 production amid AI packaging demand.

Advanced packaging is now a critical path for AI chip supply, and the companies that can deliver high-volume, high-yield inspection and automation tools will shape how quickly data centers can be built out. Nightfood's move into wafer sorters and AOI systems through TechForce Advanced Manufacturing highlights how smaller players are positioning themselves in a supply chain dominated by NVIDIA, AMD and Broadcom. If successful, this could diversify the supplier base for packaging-related equipment, potentially easing bottlenecks and creating new investment opportunities in the AI infrastructure ecosystem.