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TechForce Robotics Targets AI Packaging with New Wafer Sorter Unit

Nightfood's TechForce Robotics forms Advanced Manufacturing to produce automated Wafer Sorters and AOI systems for AI chip packaging, targeting Q4 2026 revenue.

The AI industry's next great race isn't just about designing faster chips—it's about packaging them at scale. As NVIDIA pushes suppliers to expand CoWoS-L capacity, the automation and inspection layers that support advanced packaging become critical. Nightfood's TechForce Advanced Manufacturing aims to supply automated Wafer Sorter and AOI systems for 8-inch and 12-inch wafers, targeting Q4 2026 production. If successful, this could help alleviate packaging bottlenecks that currently limit AI chip supply. For investors and industry watchers, it signals a broadening opportunity beyond chip designers into the specialized equipment that keeps AI data centers supplied. The move also highlights Taiwan's role as a manufacturing partner and the growing importance of yield and speed in the AI supply chain.