Curated News
By: NewsRamp Editorial Staff
October 10, 2024
Eliyan Corporation Delivers Industry's Highest-Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
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- Eliyan Corporation achieves industry’s highest performance chiplet interconnect at 64Gbps, doubling bandwidth for multi-die architectures.
- Eliyan's NuLink™-2.0 PHY, manufactured in a 3nm process, supports standard and advanced packaging, improving Die-to-Memory bandwidth by over 2x.
- Eliyan's breakthrough technology enables high-performance computing applications with reduced costs, manufacturing waste, and power consumption, benefiting various markets including aerospace, automotive, and industrial applications.
- Eliyan's NuLink™-2.0 PHY achieves an industry milestone with the highest die-to-die PHY solution performance, further confirming the company's ability to extend die-to-die connectivity by 2x higher bandwidth.
Impact - Why it Matters
This news matters because Eliyan's breakthrough technology enables the industry’s highest performing chiplet interconnect for homogenous and heterogenous multi-die architectures, reducing costs, manufacturing waste, and power consumption. The milestone achievement also has applications in AI, HPC, gaming, aerospace, automotive, and industrial markets, impacting the future of high-performance computing applications.
Summary
Eliyan Corporation has successfully delivered the first silicon for its NuLink™-2.0 PHY, achieving a record-breaking 64Gbps per bump, doubling the industry's highest performance for die-to-die PHY solutions. This milestone confirms Eliyan's ability to extend die-to-die connectivity by 2x higher bandwidth, on standard as well as advanced packaging, at unprecedented power, area, and latency. The NuLink-2.0 PHY also supports standard and advanced packaging, improving Die-to-Memory bandwidth by over 2x using UMI technology, with applications in AI, HPC, and gaming, and reducing power and area requirements. The solution enables high-performance multi-die architectures at lower power and lower costs, making it suitable for various markets, including aerospace, automotive, and industrial applications.
Source Statement
This curated news summary relied on this press release disributed by NewMediaWire. Read the source press release here, Eliyan Corporation Delivers Industry's Highest-Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process
