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Eliyan Corporation Delivers Industry's Highest-Performing Chiplet Interconnect PHY at 64Gbps in 3nm Process

Eliyan Corporation achieves industry's highest performance for die-to-die PHY solutions with the successful delivery of its NuLink-2.0 PHY at 64Gbps in a 3nm process. The breakthrough technology has applications in AI, HPC, gaming, aerospace, automotive, and industrial markets, impacting the future of high-performance computing applications.

This news matters because Eliyan's breakthrough technology enables the industry’s highest performing chiplet interconnect for homogenous and heterogenous multi-die architectures, reducing costs, manufacturing waste, and power consumption. The milestone achievement also has applications in AI, HPC, gaming, aerospace, automotive, and industrial markets, impacting the future of high-performance computing applications.